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2023.01.31
[Zhongshi Innovation] New solder paste, QFN can easily exceed 85%!
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QFN, square flat pin-free package, is one of the surface mount type packages.
According to the standard QFN side pad climbing requirements of IPC-A-610, it is divided into three grades:
Level 1: The bottom of QFN pad is obviously wet;
Level 2 is 25% of the height of the side pad;
The level 3 standard is 50% of the height of the side pad;
Nowadays, the development of electronic components is changing rapidly, 50% of the tin standard, and even 60% to 70% of the tin is far from meeting the needs of some customers.
Adhering to the core value of "focusing on customer needs, providing competitive products, making customers more excellent", Zhongshi Company actively carries out research and development work, side by side with customers, to overcome technical problems.
Recently, Zhongshi Company independently developed new solder paste, model: ZSRX01-RMB3, after several rounds of internal testing and external samples, QFN climbing tin easily reached 85%-90%.
The sample data are as follows:
Real RMB3 tin paste QFN climbing tin 85%-90%
Compared with the solder paste QFN of a manufacturer, the solder paste climbed 60%-70%
The real RMB3 solder paste has less residue after welding, and the appearance is transparent
The hole rate after solder paste welding is 7.724%
ZSRX01-RMB3 Product Features:
Halogen-free;
High reliability;
Ultra-low void rate;
Less residue after welding, transparent appearance;
QFN climbing tin good.
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Free sample and order, welcome to contact us!
Tel: 0769-82885678