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Solder Paste
SOLDER PASTE
Lead-free Solder paste
Halogen-free Solder paste
Tin Lead Solder paste
Low Silver High Reliability solder paste
High Strength Solder paste
Jetting Solder Paste
Solder Pastes for Laser Soldering
Micron Solder Powder
Tin Lead Solder paste
Tin Lead Solder paste-ZSPM01
High reliability, low voidage; Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc.
Product Characteristics
ZSRH01-N can completely solve the problem of oxidizing part electrodes placed for a long time, solder pads with poor condition of tinspray plates, Ni materials that are difficult to weld, QFN/Au plating modules with tin climbing problems, etc.
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Specification
| METAL COMPOSITION | PARTICLE | FLUX CONTENT |
|
SAC305 SAC105 SAC0307 |
Type3（25～45um） | 11.5±0.5% |
| Type4（20～38um） | 11.7±0.5% | |
| Type5（15～32um） | 11.8±0.5% |
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Product Characteristics
|
ITEM |
CHARACTERISTIC VALUE |
TEST METHOD |
|
| Halide Content（％） | 0.20±0.05 | JIS Z 3197-8.1.4.2.1 | |
| Copper Plate corrosion | Unoccurred | JIS Z 3284-4 | |
| Aqueous Impedance（Ω?cm） | ＞1×104 | JIS Z 3197-8.1.1 | |
|
Insulation Impedance （Ω）?? |
40℃/90%RH | ＞1×1011 | JIS Z 3284-3 |
| 85℃/85%RH | ＞1×108 | ||
| Migration Test | No migration | JIS Z 3284-14 | |
| Diffusivity（％） | ＞ 75 | JIS Z 3197-8.3.1.1 | |
| Viscosity（Pa?s） | 180±30 | JIS Z 3284-6 | |
| Tin Shot | Lv.1～3 | JIS Z 3284-11 | |
| Printability | M3 | JIS Z 3284-5 | |
| Printing Collapse | 0.3mm below | JIS Z 3284-7 | |
| Heating Collapse | 0.3mm?below | JIS Z 3284-8 | |
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Tin Lead Solder paste ZSPM01-N
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