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Solder Paste
SOLDER PASTE
Tin Lead Solder paste-ZSPM01
High reliability, low voidage; Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc.
Product Characteristics
ZSRH01-N can completely solve the problem of oxidizing part electrodes placed for a long time, solder pads with poor condition of tinspray plates, Ni materials that are difficult to weld, QFN/Au plating modules with tin climbing problems, etc.
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Specification
| METAL COMPOSITION | PARTICLE | FLUX CONTENT |
|
SAC305 SAC105 SAC0307 |
Type3（25～45um） | 11.5±0.5% |
| Type4（20～38um） | 11.7±0.5% | |
| Type5（15～32um） | 11.8±0.5% |
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Product Characteristics
|
ITEM |
CHARACTERISTIC VALUE |
TEST METHOD |
|
| Halide Content（％） | 0.20±0.05 | JIS Z 3197-8.1.4.2.1 | |
| Copper Plate corrosion | Unoccurred | JIS Z 3284-4 | |
| Aqueous Impedance（Ω?cm） | ＞1×104 | JIS Z 3197-8.1.1 | |
|
Insulation Impedance （Ω）?? |
40℃/90%RH | ＞1×1011 | JIS Z 3284-3 |
| 85℃/85%RH | ＞1×108 | ||
| Migration Test | No migration | JIS Z 3284-14 | |
| Diffusivity（％） | ＞ 75 | JIS Z 3197-8.3.1.1 | |
| Viscosity（Pa?s） | 180±30 | JIS Z 3284-6 | |
| Tin Shot | Lv.1～3 | JIS Z 3284-11 | |
| Printability | M3 | JIS Z 3284-5 | |
| Printing Collapse | 0.3mm below | JIS Z 3284-7 | |
| Heating Collapse | 0.3mm?below | JIS Z 3284-8 | |
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Tin Lead Solder paste ZSPM01-N
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